? semiconductor components industries, llc, 2012 january, 2012 ? rev. 8 1 publication order number: mbra130lt3/d mbra130lt3g, NRVBA130LT3G surface mount schottky power rectifier sma power surface mount package this device employs the schottky barrier principle in a metal ? to ? silicon power rectifier. features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. features ? compact package with j ? bend leads ideal for automated handling ? highly stable oxide passivated junction ? guardring for over ? voltage protection ? low forward voltage drop ? aec ? q101 qualified and ppap capable ? nrvba prefix for automotive and other applications requiring unique site and control change requirements ? all packages are pb ? free* mechanical characteristics: ? case: molded epoxy ? epoxy meets ul 94 v ? 0 @ 0.125 in ? weight: 70 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 ? c max. for 10 seconds ? polarity: cathode lead indicated by either notch in plastic body or polarity band ? device meets msl1 requirements ? esd ratings: ? machine model = c (> 400 v) ? human body model = 3b (> 8000 v) *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. http://onsemi.com marking diagram sma case 403d plastic device package shipping ? ordering information schottky barrier rectifier 1.0 amperes, 30 volts ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. mbra130lt3g sma (pb ? free) 5,000 / tape & reel ** b1l3 = specific device code a = assembly location y = year ww = work week = pb ? free package b1l3 ayww NRVBA130LT3G sma (pb ? free) 5,000 / tape & reel ** ** 12 mm tape, 13? reel
mbra130lt3g, NRVBA130LT3G http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 30 v average rectified forward current (at rated v r , t c = 105 ? c) i o 1.0 a peak repetitive forward current (at rated v r , square wave, 100 khz, t c = 105 ? c) i frm 2.0 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 25 a storage temperature t stg ? 55 to +150 ? c operating junction temperature t j ? 55 to +125 ? c voltage rate of change, (rated v r , t j = 25 ? c) dv/dt 10,000 v/ s stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics characteristic symbol value unit thermal resistance ? junction ? to ? lead (note 1) thermal resistance ? junction ? to ? ambient (note 1) r jl r ja 35 86 ? c/w 1. mounted on 2 ? square pc board with 1 ? square total pad size, pc board fr4. electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (note 2) (i f = 1.0 a) see figure 2 (i f = 2.0 a) v f t j = 25 ? c t j = 100 ? c volts 0.41 0.47 0.35 0.43 maximum instantaneous reverse current (v r = 30 v) see figure 4 (v r = 15 v) i r t j = 25 ? c t j = 100 ? c ma 1.0 0.4 25 12 2. pulse test: pulse width ? 250 s, duty cycle ? 2.0%.
mbra130lt3g, NRVBA130LT3G http://onsemi.com 3 figure 1. typical forward voltage figure 2. maximum forward voltage figure 3. typical reverse current figure 4. maximum reverse current v f , instantaneous forward voltage (volts) 10 1.0 0.1 v f , maximum instantaneous forward voltage (volts) 0.4 1.0 0 0.1 0 v r , reverse voltage (volts) 1.0e-6 i f , instantaneous forward current (amps ) i i 0.6 0.8 1.0 0.6 0.8 0.2 1.0 10 t j = 25 ? c 10 20 0 0.2 0.4 30 , instantaneous forward current (amps) f t j = 85 ? c t j = 125 ? c t j = 25 ? c t j = 85 ? c t j = 125 ? c t j = -40 ? c 10e-6 100e-6 t j = 25 ? c t j = 85 ? c t j = 125 ? c 1.0e-3 10e-3 100e-3 , reverse current (amps) r 0 v r , reverse voltage (volts) 1.0e-6 i 10 20 30 10e-6 100e-6 t j = 25 ? c t j = 85 ? c 1.0e-3 10e-3 100e-3 , maximum reverse current (amps) r
mbra130lt3g, NRVBA130LT3G http://onsemi.com 4 ipk/io = figure 5. current derating figure 6. forward power dissipation 20 100 0 t l , lead temperature ( ? c) 2.0 1.6 0.4 0 i o , average forward current (amps) 60 , average forward current (amps) o 120 140 0.8 1.2 i 0.2 1.0 0 0.6 0.5 0.4 0.2 0 0.6 , average power dissipation (watts) fo 1.2 1. 6 0.1 0.3 p 40 80 0.4 0.8 1.4 ipk/io = 20 dc square wave ipk/io = 5 ipk/io = 10 ipk/io = 20 freq = 20 khz ipk/io = 10 ipk/io = 5 ipk/io = square wave dc 1.8 0.6 0.2 1.0 1.4 figure 7. thermal response figure 8. capacitance 100e-6 10e-6 t, time (s) 1.0e+0 10e-3 1.0e-3 100e-6 5.0 30 0 v r , reverse voltage (volts) 1000 100 10 1.0 20 r (t) , transient thermal resistance (normalized) c, capacitance (pf) 100e-3 10e-3 10e+0 100e+0 1.0e+3 100e-3 15 10 25 35 1.0e+0 1.0e-3 40 t j = 25 ? c t, time (s)
mbra130lt3g, NRVBA130LT3G http://onsemi.com 5 package dimensions dim a min nom max min millimeters 1.97 2.10 2.20 0.078 inches a1 0.05 0.10 0.15 0.002 b 1.27 1.45 1.63 0.050 c 0.15 0.28 0.41 0.006 d 2.29 2.60 2.92 0.090 e 4.06 4.32 4.57 0.160 l 0.76 1.14 1.52 0.030 0.083 0.087 0.004 0.006 0.057 0.064 0.011 0.016 0.103 0.115 0.170 0.180 0.045 0.060 nom max 4.83 5.21 5.59 0.190 0.205 0.220 h e sma case 403d ? 02 issue f style 1: pin 1. cathode (polarity band) 2. anode e bd l c a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 403d ? 01 obsolete, new standard is 403d ? 02. polarity indicator optional as needed (see styles) 4.0 0.157 2.0 0.0787 2.0 0.0787 mm inches scale 8:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbra130lt3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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